Our Gold Polyimide BGA Tape offers top-notch heat resistance and durability. Ideal for high-temperature applications and BGA assemblies, this tape features a strong adhesive for secure bonding and effective thermal insulation. Protect your electronics with confidence.
- Gold Polyimide Material: Superior heat resistance.
- High-Temperature Tolerance: Reliable in extreme conditions.
- BGA Compatible: Perfect for Ball Grid Array applications.
- Strong Adhesive: Ensures a secure bond.
Additional information
Length | 33M |
---|---|
Width | 18Mm |
Reviews
There are no reviews yet.